Universal thermal compound for processors of consoles or PC.
Silicone-based, this thermal compound has got metal oxides which provide high heat transfer between processor/heatsink.
Key features :
- Replacement thermal compound
- Composition : Silicone and metal oxides
- Thermal conductance : > 1.172W/m-K
- Thermal resistance : < 0.195°C-in2/W
- Packed in dose packet (1g)
- Support all versions of XBOX 360™ console = 1 dose
- Support all versions of PS3™ console = 2 doses
- Support all versions of PC = 1 dose
- Grey color
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