1. Home
  2. Home
  3. Equipment
  4. Soldering
  5. BGA Solder Balls
BGA Solder Balls - 0.45/0.50/0.55 mm

Share on Facebook Share on X Share via E-Mail

BGA Solder Balls - 0.45/0.50/0.55 mm
SOL-BGASOLBAL - (0 notes)



Condition: New
Weight: 0.025 kg


6.00 €Incl.
Tax
20% VAT5.00 €Excl.
Tax
Qty. 1+ 2+ 5+
Unit Price 6.00 € 5.70 € 5.40 €
Discount 0% 5% 10%
Diameter Price Qty
0.45 mm 6.00 € 8
0.50 mm 6.00 € 8
0.55 mm 6.00 € 8

Options

Diameter
In Stock
Our deadline commitments:
  • Product in stock dispatched next Monday
  • Immediate shipment after payment acceptance
  • Return possible within 14 days after delivery
Qty :

Required information



Solder balls for BGA works on electronical motherboards.
Lead/tin alloy.
 
Key features :
  • BGA solder balls
  • Lead/tin alloy (37/63)
  • Melting point : 179°C
  • Quantity ≃ 25.000 pcs
  • 0.45 mm diameter / 18g bottle (RAM DDR2, DDR3, DDR5)
  • 0.50 mm diameter / 20g bottle (SCEI SouthBridge PS4)
  • 0.55 mm diameter / 22g bottle (APU PS4)
  • Packaging : Glass bottle
  • Diameter at choice
BGA, Solder, Balls, 0.45 mm, 0.50 mm, 0.55 mm, Reballing
There are currently no product reviews.

Write Review

Secure Payment